Identifier: 10.3139/9781569905524

Identifier Namespace
doi
Identifier
10.3139/9781569905524


Identified Components with same Identifier:

Title Package Namespace
Three-Dimensional Molded Interconnect Devices (3D-MID) (Current) eBook - Freedom Collection Books and Backlist doi
Three-Dimensional Molded Interconnect Devices (3D-MID) (Current) eBook - Freedom Collection Books 2023 and Backlist doi
Three-Dimensional Molded Interconnect Devices (3D-MID) (Current) Hanser eLibrary EBS title_id
Three-Dimensional Molded Interconnect Devices (3D-MID) : Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers (Current) Hanser eLibrary All In title_id
Edit (Login required)
Date Created
2024-04-19 10:30:40
Last Updated
2024-04-19 10:30:40
UUID
2f29f5a5-7608-4db6-b48b-be328d6d069b


Loading