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Title
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Three-Dimensional Molded Interconnect Devices (3D-MID) : Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers
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Package
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Hanser eLibrary All In
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Platform
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Hanser eLibrary
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URL
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https://www.hanser-elibrary.com/doi/book/10.3139/9781569905524
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Status
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Current
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Publication Type
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Monograph
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Medium
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Empty
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Language
-
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First Author
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Empty
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First Editor
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Franke
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Publisher Name
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Hanser Verlag
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Date First in Print
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2014-04-01
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Date First Online
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2014-04-23
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Access Start Date
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Empty
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Access End Date
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Empty
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Volume Number
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Empty
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Edition Statement
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Empty
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Access Type
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Free
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Note
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Empty
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Last Changed External
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Empty
- Date Created
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2022-02-24 09:46:05
- Last Updated
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2024-08-26 21:01:13
- UUID
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465c0340-6eaa-4680-be2e-f5f4452bbd33
| Identifier Namespace Name |
Identifier Namespace Value |
Identifier |
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eISBN
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eisbn
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978-1-56990-552-4
|
|
ISBN
|
isbn
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978-1-56990-551-7
|
|
Title_ID
|
title_id
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10.3139/9781569905524
|
| Dewey Decimal Classification |
-
Series
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Empty
-
Parent publication title ID
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Empty
-
Superseding publication title ID
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Empty
-
Preceding publication title ID
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Empty
| Price Type |
Value |
Currency |