Title: Three-Dimensional Molded Interconnect Devices (3D-MID)
- Title
- Three-Dimensional Molded Interconnect Devices (3D-MID)
- Package
- Hanser eLibrary EBS
- Platform
- Hanser eLibrary
- Status
- Current
- Publication Type
- Monograph
- Medium
- Book
- Language
-
- First Author
- Franke
- First Editor
- Empty
- Publisher Name
- Hanser Verlag
- Date First in Print
- 2014-04-01
- Date First Online
- 2014-04-01
- Access Start Date
- 2014-04-01
- Access End Date
- Empty
- Volume Number
- Empty
- Edition Statement
- 1
- Access Type
- Paid
- Note
- Empty
- Last Changed External
- 2023-12-22
- Date Created
- 2021-07-15 11:22:21
- Last Updated
- 2024-01-01 20:04:44
- UUID
- 92b1f5c3-d968-4253-a8f7-17d3e602d318
- Subject Area
- Plastics
Dewey Decimal Classification |
---|
660: Chemical engineering |
- Series
- Empty
- Parent publication title ID
- Empty
- Superseding publication title ID
- Empty
- Preceding publication title ID
- Empty
- Open Access
- Empty
Price Type | Value | Currency |
---|---|---|
list | 188.3 | EUR |