-
Title
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Three-Dimensional Molded Interconnect Devices (3D-MID)
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Package
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eBook - Freedom Collection Books and Backlist
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Platform
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ScienceDirect
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URL
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https://www.sciencedirect.com/science/book/9781569905517
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Status
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Current
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Publication Type
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Monograph
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Medium
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Book
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Language
-
-
First Author
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Jörg Franke
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First Editor
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Empty
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Publisher Name
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Hanser
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Date First in Print
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2013-01-01
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Date First Online
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2014-07-11
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Access Start Date
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2014-07-11
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Access End Date
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Empty
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Volume Number
-
Empty
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Edition Statement
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Empty
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Access Type
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Paid
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Note
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Empty
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Last Changed External
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2022-03-16
- Date Created
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2022-03-17 13:04:04
- Last Updated
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2023-07-24 13:38:34
- UUID
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f5269290-f562-4254-8d89-07929186d73f
| Identifier Namespace Name |
Identifier Namespace Value |
Identifier |
|
DOI
|
doi
|
10.3139/9781569905524
|
|
eISBN
|
eisbn
|
978-1-56990-551-7
|
|
Title_ID
|
title_id
|
9781569905517
|
-
Subject Area
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Materials Science
| Dewey Decimal Classification |
-
Series
-
Empty
-
Parent publication title ID
-
Empty
-
Superseding publication title ID
-
Empty
-
Preceding publication title ID
-
Empty
| Price Type |
Value |
Currency |
| list |
163.0 |
EUR |