Identifier: 10.3139/9781569905524

Identifier Namespace
title_id
Identifier
10.3139/9781569905524


Identified Components with same Identifier:

Title Package Namespace
Three-Dimensional Molded Interconnect Devices (3D-MID) (Current) eBook - Freedom Collection Books and Backlist doi
Three-Dimensional Molded Interconnect Devices (3D-MID) (Current) eBook - Freedom Collection Books 2023 and Backlist doi
Three-Dimensional Molded Interconnect Devices (3D-MID) (Current) Hanser eLibrary EBS title_id
Three-Dimensional Molded Interconnect Devices (3D-MID) : Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers (Current) Hanser eLibrary All In title_id
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Date Created
2021-07-15 11:22:21
Last Updated
2021-07-15 11:22:21
UUID
1c3d6535-e159-4878-99f8-763a6100e7d5


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