Identifier: 978-1-56990-552-4

Identifier Namespace
eisbn
Identifier
978-1-56990-552-4


Identified Components with same Identifier:

Title Package Namespace
Three-Dimensional Molded Interconnect Devices (3D-MID) : Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers (Current) Hanser eLibrary All In eisbn
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Date Created
2020-07-03 12:04:23
Last Updated
2020-07-03 12:04:23
UUID
215e5190-9250-478f-be83-ad9082371976


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