- Date Created
- 2024-08-30 09:35:31
- Last Updated
- 2024-08-30 09:35:31
- UUID
- 111da1f8-5498-4f05-b46d-39e93b950b3d
Title Update Infos: Thermal Management Materials for Electronic Packaging - Preparation, Characterization, and Devices
- Package Update Info
- Wiley UBCM Full Collection
- Title
- Thermal Management Materials for Electronic Packaging - Preparation, Characterization, and Devices
- Description
- Changes in Title 'Thermal Management Materials for Electronic Packaging - Preparation, Characterization, and Devices'
- Status
- Successful
- Type
- Changed Title
- Start Time
- 2024-08-30
- End Time
- 2024-08-30
- KBART Field
- last_changed
- Old Value
- 2024-02-01
- New value
- 2024-08-16