Title Update Infos: Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Package Update Info
eBook - Freedom Collection Books Backlist [EBFCBBL]
Title
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Description
Changes in Title 'Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore'
Status
Successful
Type
Changed Title
Start Time
2024-02-05
End Time
2024-02-05
KBART Field
access_type
Old Value
Empty
New value
Paid
Date Created
2024-02-05 20:28:38
Last Updated
2024-02-05 20:28:38
UUID
b1ff1797-d456-4072-9549-2fcfbba7a72d


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