Title Update Infos: Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Package Update Info
eBook - Freedom Collection Books Backlist [EBFCBBL]
Title
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Description
New Title 'Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore'
Status
Successful
Type
New Title
Start Time
2024-01-29
End Time
2024-01-29
KBART Field
Empty
Old Value
Empty
New value
Empty
Date Created
2024-01-29 20:23:38
Last Updated
2024-01-29 20:23:38
UUID
efe9eacc-2d6e-489d-a0bc-774231c71c9b


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