- Date Created
- 2023-09-03 20:02:05
- Last Updated
- 2023-09-03 20:02:05
- UUID
- 152a45d3-ae13-4b2b-8e83-709a6b4d0f75
Title Update Infos: Three-Dimensional Molded Interconnect Devices (3D-MID)
- Package Update Info
- eBook - Freedom Collection Books 2017 [EBFCBL17]
- Description
- New Title 'Three-Dimensional Molded Interconnect Devices (3D-MID)'
- Status
- Successful
- Type
- New Title
- Start Time
- 2023-09-03
- End Time
- 2023-09-03
- KBART Field
- Empty
- Old Value
- Empty
- New value
- Empty