Title Update Infos: 3D Interconnect Architectures for Heterogeneous Technologies

Package Update Info
Springer Nature - Springer Engineering eBooks 2022 English International
Title
3D Interconnect Architectures for Heterogeneous Technologies
Description
Changes in Title '3D Interconnect Architectures for Heterogeneous Technologies'
Status
Successful
Type
Changed Title
Start Time
2023-03-21
End Time
2023-03-21
KBART Field
first_author
Old Value
Empty
New value
Bamberg
Date Created
2023-03-21 09:57:31
Last Updated
2023-03-21 09:57:31
UUID
b8ca20a0-cdf6-4c5c-b27c-f0a1c7b5bab0


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