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Title
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Three-Dimensional Molded Interconnect Devices (3D-MID)
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Package
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eBook - Plastics Engineering Hanser 2014 [EBCPEH14]
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Platform
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ScienceDirect
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URL
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https://www.sciencedirect.com/science/book/9781569905517
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Status
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Current
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Publication Type
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Monograph
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Medium
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Empty
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Language
-
-
First Author
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Jörg Franke
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First Editor
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Empty
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Publisher Name
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Hanser
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Date First in Print
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2013-01-01
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Date First Online
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2014-07-11
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Access Start Date
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Empty
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Access End Date
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Empty
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Volume Number
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Empty
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Edition Statement
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Empty
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Access Type
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Paid
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Note
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Empty
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Last Changed External
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Empty
- Date Created
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2021-11-22 23:21:41
- Last Updated
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2024-08-26 20:26:04
- UUID
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531d5415-b399-47c6-8f60-222d1e034b0e
Identifier Namespace Name |
Identifier Namespace Value |
Identifier |
eISBN
|
eisbn
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978-1-56990-551-7
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Title_ID
|
title_id
|
9781569905517
|
Dewey Decimal Classification |
-
Series
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Empty
-
Parent publication title ID
-
Empty
-
Superseding publication title ID
-
Empty
-
Preceding publication title ID
-
Empty
Price Type |
Value |
Currency |