-
Title
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Harsh Environment Electronics - Interconnect Materials and Performance Assessment
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Package
-
Wiley UBCM Full Collection
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Platform
-
Wiley Online Library
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URL
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https://onlinelibrary.wiley.com/doi/book/10.1002/9783527813964
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Status
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Current
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Publication Type
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Monograph
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Medium
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Book
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Language
-
-
First Author
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Sharif
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First Editor
-
Empty
-
Publisher Name
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John Wiley & Sons, Inc.
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Date First in Print
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2019-07-26
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Date First Online
-
2019-03-29
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Access Start Date
-
2019-03-29
-
Access End Date
-
Empty
-
Volume Number
-
Empty
-
Edition Statement
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1
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Access Type
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Paid
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Note
-
Empty
-
Last Changed External
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2024-08-16
- Date Created
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2021-07-20 10:03:29
- Last Updated
-
2024-08-30 09:35:25
- UUID
-
240f20d0-794b-4983-bdc5-731a43dd494a
Identifier Namespace Name |
Identifier Namespace Value |
Identifier |
DOI
|
doi
|
10.1002/9783527813964
|
eISBN
|
eisbn
|
9783527813964
|
ISBN
|
isbn
|
9783527344192
|
Title_ID
|
title_id
|
10.1002/9783527813964
|
-
Subject Area
-
Materials Science
Dewey Decimal Classification |
-
Series
-
Empty
-
Parent publication title ID
-
Empty
-
Superseding publication title ID
-
Empty
-
Preceding publication title ID
-
Empty
Price Type |
Value |
Currency |
list |
188.95 |
USD |