-
Title
-
3D and Circuit Integration of MEMS
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Package
-
Wiley UBCM Full Collection
-
Platform
-
Wiley Online Library
-
URL
-
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527823239
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Status
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Current
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Publication Type
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Monograph
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Medium
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Book
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Language
-
-
First Author
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Esashi
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First Editor
-
Empty
-
Publisher Name
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John Wiley & Sons, Inc.
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Date First in Print
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2021-07-07
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Date First Online
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2021-04-23
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Access Start Date
-
2021-04-23
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Access End Date
-
Empty
-
Volume Number
-
Empty
-
Edition Statement
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1
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Access Type
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Paid
-
Note
-
Empty
-
Last Changed External
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2024-08-16
- Date Created
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2021-07-20 08:34:06
- Last Updated
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2024-08-30 09:35:26
- UUID
-
0bcfa947-06d7-4420-8a94-4fd0d58bd373
| Identifier Namespace Name |
Identifier Namespace Value |
Identifier |
|
DOI
|
doi
|
10.1002/9783527823239
|
|
eISBN
|
eisbn
|
9783527823239
|
|
ISBN
|
isbn
|
9783527346479
|
|
Title_ID
|
title_id
|
10.1002/9783527823239
|
-
Subject Area
-
Materials Science
| Dewey Decimal Classification |
-
Series
-
Empty
-
Parent publication title ID
-
Empty
-
Superseding publication title ID
-
Empty
-
Preceding publication title ID
-
Empty
| Price Type |
Value |
Currency |
| list |
185.0 |
USD |