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Title
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Entwicklung eines mehrschichtigen Atomchip-Systems mit integrierter Temperatur-Sensorik für den Einsatz unter Weltraumbedingungen
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Package
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VDI und Partner Materialwiss., Produktgestaltung, Fertigung, Logistik 2024
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Platform
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VDI Verlag-eLibrary
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URL
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https://elibrary.vdi-verlag.de/10.51202/9783959009508
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Status
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Current
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Publication Type
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Monograph
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Medium
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Book
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Language
-
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First Author
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Kassner, Alexander
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First Editor
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Empty
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Publisher Name
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TEWISS
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Date First in Print
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2024-06-19
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Date First Online
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2024-06-19
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Access Start Date
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Empty
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Access End Date
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Empty
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Volume Number
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01/2024
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Edition Statement
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Empty
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Access Type
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Paid
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Note
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Empty
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Last Changed External
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2024-07-16
- Date Created
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2024-07-22 20:08:03
- Last Updated
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2024-09-02 20:43:19
- UUID
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7975ced7-ef3e-49be-aef3-6d74ab011f7a
Identifier Namespace Name |
Identifier Namespace Value |
Identifier |
DOI
|
doi
|
10.51202/9783959009508
|
eISBN
|
eisbn
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9783959009508
|
ISBN
|
isbn
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978-3-95900-950-8
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Title_ID
|
title_id
|
10.51202/9783959009508
|
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Subject Area
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Agrar- und Umwelttechnik
Dewey Decimal Classification |
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Series
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Berichte aus dem IMPT
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Parent publication title ID
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LJ461
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Superseding publication title ID
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Empty
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Preceding publication title ID
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Empty
Price Type |
Value |
Currency |