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Title
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Reflow Soldering Processes
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Package
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Book Series Backfile Package - Neuroscience [YBNEUR]
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Platform
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ScienceDirect
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URL
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https://www.sciencedirect.com/science/book/9780750672184
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Status
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Deleted
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Publication Type
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Monograph
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Medium
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Empty
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Language
-
-
First Author
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Ning-Cheng Lee
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First Editor
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Empty
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Publisher Name
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Newnes
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Date First in Print
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2001-01-01
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Date First Online
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2007-09-02
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Access Start Date
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Empty
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Access End Date
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Empty
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Volume Number
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Empty
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Edition Statement
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Empty
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Access Type
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Empty
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Note
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Empty
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Last Changed External
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Empty
- Date Created
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2024-01-22 20:44:13
- Last Updated
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2024-04-13 20:00:56
- UUID
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5ec4f814-adaa-4ab6-9797-20b2e99435eb
Identifier Namespace Name |
Identifier Namespace Value |
Identifier |
eISBN
|
eisbn
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978-0-7506-7218-4
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Title_ID
|
title_id
|
9780750672184
|
Dewey Decimal Classification |
-
Series
-
Empty
-
Parent publication title ID
-
Empty
-
Superseding publication title ID
-
Empty
-
Preceding publication title ID
-
Empty
Price Type |
Value |
Currency |