Title: Modeling and Application of Flexible Electronics Packaging
- Title
- Modeling and Application of Flexible Electronics Packaging
- Platform
- SpringerLink
- Status
- Current
- Publication Type
- Monograph
- Medium
- Book
- Language
-
English
- First Author
- "Huang, YongAn"
- First Editor
- Empty
- Publisher Name
- Springer Nature Singapore
- Date First in Print
- 2019-01-01
- Date First Online
- 2019-01-01
- Access Start Date
- 2019-04-23
- Access End Date
- Empty
- Volume Number
- Empty
- Edition Statement
- 1
- Access Type
- Empty
- Note
- Empty
- Last Changed External
- Empty
- Date Created
- 2023-08-10 17:31:16
- Last Updated
- 2023-08-10 17:31:19
- UUID
- 0ba68403-778e-43e0-9e1b-a71fdbcaec23
Identifier Namespace Name | Identifier Namespace Value | Identifier |
---|---|---|
eISBN | eisbn | 978-981-13-3627-0 |
ISBN | isbn | 978-981-13-3626-3 |
Title_ID | title_id | 10.1007/978-981-13-3627-0 |
- Subject Area
- Engineering
Dewey Decimal Classification |
---|
- Series
- Empty
- Parent publication title ID
- Empty
- Superseding publication title ID
- Empty
- Preceding publication title ID
- Empty
- Open Access
- Empty
Price Type | Value | Currency |
---|---|---|
list | 89.99 | EUR |