-
Title
-
Industry Standard FDSOI Compact Model BSIM-IMG for IC Design
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Package
-
ProQuest_Ebook Central DDA
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Platform
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Ebook Central
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URL
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https://ebookcentral.proquest.com/lib/ebooksnrw/detail.action?docID=5779402
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Status
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Current
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Publication Type
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Monograph
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Medium
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Book
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Language
-
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First Author
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Hu, Chenming
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First Editor
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Empty
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Publisher Name
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Elsevier Science & Technology
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Date First in Print
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2019-05-22
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Date First Online
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2019-05-22
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Access Start Date
-
Empty
-
Access End Date
-
Empty
-
Volume Number
-
Empty
-
Edition Statement
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1
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Access Type
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Paid
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Note
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Empty
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Last Changed External
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2023-08-18
- Date Created
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2023-04-28 14:26:10
- Last Updated
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2023-11-16 15:25:41
- UUID
-
4224e27c-4a61-42c5-9ff7-77fd77c71f1b
| Identifier Namespace Name |
Identifier Namespace Value |
Identifier |
|
eISBN
|
eisbn
|
9780081024027
|
|
ISBN
|
isbn
|
9780081024010
|
|
Title_ID
|
title_id
|
5779402
|
-
Subject Area
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Engineering: Electrical; Engineering
| Dewey Decimal Classification |
-
Series
-
Woodhead Publishing Series in Electronic and Optical Materials Series
-
Parent publication title ID
-
Empty
-
Superseding publication title ID
-
Empty
-
Preceding publication title ID
-
Empty
| Price Type |
Value |
Currency |
| list |
213.7 |
EUR |
| list |
228.0 |
USD |