-
Title
-
TSV 3D RF Integration
-
Package
-
ProQuest_Ebook Central DDA
-
Platform
-
Ebook Central
-
URL
-
https://ebookcentral.proquest.com/lib/ebooksnrw/detail.action?docID=6963985
-
Status
-
Current
-
Publication Type
-
Monograph
-
Medium
-
Book
-
Language
-
-
First Author
-
Ma, Shenglin
-
First Editor
-
Empty
-
Publisher Name
-
Elsevier
-
Date First in Print
-
2022-04-27
-
Date First Online
-
2022-04-27
-
Access Start Date
-
Empty
-
Access End Date
-
Empty
-
Volume Number
-
Empty
-
Edition Statement
-
1
-
Access Type
-
Paid
-
Note
-
Empty
-
Last Changed External
-
2023-07-27
- Date Created
-
2023-04-28 12:09:34
- Last Updated
-
2023-11-16 14:35:38
- UUID
-
101c242b-7732-4290-a7c8-590b552a8c50
| Identifier Namespace Name |
Identifier Namespace Value |
Identifier |
|
eISBN
|
eisbn
|
9780323996037
|
|
ISBN
|
isbn
|
9780323996020
|
|
Title_ID
|
title_id
|
6963985
|
-
Subject Area
-
Engineering: Electrical; Engineering
| Dewey Decimal Classification |
-
Series
-
Empty
-
Parent publication title ID
-
Empty
-
Superseding publication title ID
-
Empty
-
Preceding publication title ID
-
Empty
| Price Type |
Value |
Currency |
| list |
281.19 |
EUR |
| list |
300.0 |
USD |